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october 2010 doc id 17994 rev 1 1/11 11 DCPL-WB-00C2 wide-band, dual-path direct ional coupler with iso port features 50 nominal input / output impedance wide operating frequency range: ? 824 mhz-2170 mhz low insertion loss (< 0.2 db) 37 db typical coupling factor high directivity (> 20 db) high esd ruggedness lead-free csp package flip-chip package small footprint: 1700 x 1850 m very low profile (< 670 m thickness) benefits high rf performance rf module size reduction complies with the following standards: iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications multi-band equipment such as: power amplifier module front end module gsm/wcdma mobile phone figure 1. pin configuration (bump view) description the DCPL-WB-00C2 is a wide-band, dual-path directional coupler designed to measure cell phone transmission output power in gsm/wcdma applications. this dual-path cpl has been customized for wide-band operating frequencies (egsm and cell, pcs, dcs, wcdma band i) with less than 0.2 db insertion losses in the transmission bandwidth (824 mhz - 1980 mhz). this device is built with two different rf couplers (one dedicated to lb, the other dedicated to hb) sharing the same coupled and isolated ports.the DCPL-WB-00C2 has been designed using stmicroelectronics ipd (integrated passive device) technology on non-conductive glass substrate to optimize rf performance. the device is delivered 100% tested in tape and reel. lead-free flip chip (8 bumps) lb path hb path a1 a2 a3 c1 c2 c3 b1 b3 iso cpl www.st.com
characteristics DCPL-WB-00C2 2/11 doc id 17994 rev 1 1 characteristics table 1. device pin configuration bump name description a1 lbin lb coupler rf input a2 gnd rf ground a3 lbout lb coupler rf output b1 cpld coupler port b3 iso isolated port c1 hbin hb coupler rf input c2 gnd rf ground c3 hbout hb coupler output table 2. a bsolute maximum rating (limiting values) symbol parameter value unit min. typ. max. p in input power rf in (cw mode) - 36 dbm v esd (iec) esd ratings iec 61000-4-2 (c = 150 pf, r = 330 ) lb in , lb out , hb in , hb out , air discharge lb in , lb out , hb in , hb out , contact discharge 15 8 --kv v esd (hbm) human body model, jesd22-a114-b, all i/o 2 - - kv v esd (mm) machine model, jesd22-a115-a, all i/o 100 - - v v esd (cdm) charge device model, jesd22-c101-c, all i/o 500 - - v t op operating temperature -30 - +85 c table 3. electrical characteristics - impedances (t amb = 25 c) symbol parameter value unit min. typ. max. z out nominal output impedance (lb and hb paths) - 50 - z in nominal input impedance (lb and hb paths) - 50 - z cpl nominal coupled port impedance - 50 - z iso nominal isolated port impedance - 50 -
DCPL-WB-00C2 characteristics doc id 17994 rev 1 3/11 table 4. electrical characteristics - lb path rf performance (t amb = 25 c) symbol parameter test condition value unit min. typ. max. t op operating temperature -30 - +85 c f frequency range (bandwidth) 824 - 960 mhz il lb lb path insertion loss from 824 mhz to 960 mhz -0.10.2db rl lb lb path return loss from 824 mhz to 960 mhz 15 - - db cpld lb lb coupling factor from 824 mhz to 915 mhz 32 - 37 db ripple lb coupling ripple in lb (824 to 849 mhz) (880 to 915 mhz) --0.5db dir lb lb coupler directivity from 824 mhz to 915 mhz 22 - - db table 5. electrical characteristics - hb path rf performance (t amb = 25 c) symbol parameter test condition value unit min. typ. max. t op operating temperature -30 - +85 c f frequency range (bandwidth) 1710 - 1980 mhz il hb hb path insertion loss from 1710 mhz to 2170 mhz -0.10.2db rl hb hb path return loss from 1710 mhz to 2170 mhz 15 - - db cpld hb hb coupling factor from 1710 mhz to 1980 mhz 29 - 34 db ripple hb coupling ripple in hb (1710 to 1785 mhz) (1850 to 1910 mhz) (1920 to 1980 mhz) --0.5db dir hb hb coupler directivity from 1710 mhz to 1980 mhz 22 - - db
characteristics DCPL-WB-00C2 4/11 doc id 17994 rev 1 1.1 rf measurement (on reference evaluation board) measurements done on reference evaluation board under 50 , de-embedding at dcpl-wb-00d3 bumps. figure 2. low band path insertion loss figure 3. high band path insertion loss figure 4. low band path coupling factor -0.20 -0.15 -0.10 -0.05 0.00 800 820 840 860 880 900 920 940 960 980 1000 il - lb (db) f (mhz) -0.20 -0.15 -0.10 -0.05 0.00 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200 il - hb (db) f (mhz) -40 -39 -38 -37 -36 -35 -34 -33 -32 -31 -30 800 820 840 860 880 900 920 940 960 980 1000 cpld - lb (db) f (mhz)
DCPL-WB-00C2 characteristics doc id 17994 rev 1 5/11 figure 5. high band path coupling factor figure 6. low band path directivity figure 7. high band path directivity -38 - - 37 36 -35 -34 -33 -32 -31 -30 -29 -28 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200 cpld - hb (db) f (mhz) 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 800 820 840 860 880 900 920 940 960 980 1000 dir - lb (db) f (mhz) 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 17 00 17 50 1 800 1 850 1 900 1 950 2 000 2 050 21 00 21 50 22 00 dir - lb (db) f (mhz)
characteristics DCPL-WB-00C2 6/11 doc id 17994 rev 1 figure 8. demo board description - layer 1 figure 9. solder mask 1 + layer 1 copper pad diameter: 275 m solder mask diameter: 375 m
DCPL-WB-00C2 ordering information scheme doc id 17994 rev 1 7/11 2 ordering information scheme figure 10. ordering information scheme dcpl wb ? 00 c2 dual high directivity coupler wide band package c2 = coated flip chip, bump size = 315 m version ? ?
package information DCPL-WB-00C2 8/11 doc id 17994 rev 1 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. package dimensions figure 12. footprint figure 13. marking a1 a2 a3 b1 c1 c2 c3 b3 a1 a1 a2 a2 a3 a3 b1 b1 c1 c1 c2 c2 c3 c3 b3 b3 670 m 315 m dia. 1.7 mm 600m 600m 1.85 mm 685 m 685 m copper pad diameter : 250 m recommended, 300 m max solder stencil opening: 330 m solder mask opening recommendation: 340 m min for 300 m copper pad diameter x y x w z w dot, st logo ecopack status xx = marking z = manufacturing location yww = datecode (y = year ww = week)
DCPL-WB-00C2 package information doc id 17994 rev 1 9/11 figure 14. flip-chip tape and reel specifications note: more packing information is av ailable in the application notes: an1235: "flip-chip: package description and recommendations for use" an1751: "emi filters: recommendations and measurements? dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.73 1.80 0.22 1.95 xxz yww st xxz yww xxz yww st xxz yww xxz yww st xxz yww
ordering information DCPL-WB-00C2 10/11 doc id 17994 rev 1 4 ordering information 5 revision history table 6. ordering information order code marking package weight base qty delivery mode DCPL-WB-00C2 rn flip chip 3.65 mg 5000 tape and reel table 7. document revision history date revision changes 07-oct-2010 1 initial release.
DCPL-WB-00C2 doc id 17994 rev 1 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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